Equipment: Oxford Plasmalab 100 (external link) – Grant: Fapesp (Proc: 2012/17610-3)
Manager: Fred Cioldin
Backup:
Description: ICP-RIE (Reactive Ion Inductively Coupled Plasma Etching) is a device for dry corrosion assisted by plasma. Currently the equipment installed in the CCS is capable for Si and SiNx etching. The Plasma-100 have a load-lock for sample transfer to the main chamber and is equipped with a He back cooling that allows control of the electrode temperature.
Resources:
Fluroinated gases: SF6, C4F8, CF4, CHF3;
Other gases: Ar, O2, H2, Cl2;
Materials: Si, SiNx, SiOx;
Restrictions: See usage rules (in Portuguese);
MSDS: C4F8, CF4, CH4, CHF3, CL2
Other informations: Plasma-100